
More specifically, we use Atomic Layer Deposition in conjunction with various plasma chemistries to deposit highly conformal metal and dielectric film stacks. The incorporation of plasma allows us to modify the surface of the substrate and improve adhesion to subsequent films.
In addition we are investigating novel combinations of dielectric and metal monolayers tailored to provide adhesion on par with plasma-based processes. The primary goal of this work is to develop a process capable of coating both metal and dielectric nano-scale structures with a uniform thin film that can serve as a catalyst for additional film growth.
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